View UPG175TA_58630.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PRELIMINARY DATA SHEET
GaAs INTEGRATED CIRCUIT
PG175TA
L-Band PA DRIVER AMPLIFIER
DESCRIPTION
PG175TA is a GaAs MMIC for PA driver amplifier with variable gain function which was developed for PDC
(Personal Digital Cellular in Japan) and another L-band application. The device can operate with 3.0 V, having the high gain and low distortion.
FEATURES
* Low Operation Voltage: VDD1 = VDD2 = 3.0 V * fRF: 925 to 960 MHz@ Pout = +9 dBm * Low distortion: Padj1 = -60 dBc typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching * Low operation Current: IDD = 20 mA typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching * Variable gain control function: G = 35 dB typ. @ VAGC = 0.5 to 2.5 V * 6 pin mini-mold package
APPLICATION
* Digital Cellular: PDC800M, etc.
ORDERING INFORMATION (PLAN)
PART NUMBER PACKAGE 6 pin Mini-mold PACKING FORM Carrier tape width is 8 mm, Quantity is 3 kpcs per reel.
PG175TA-E3
Remark For sample order, please contact your local NEC sales office. (Part number for sample order: PG175TA)
Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET.
The information in this document is subject to change without notice.
Document No. P13470EJ1V0DS00 (1st edition) Date Published May 1998 N CP(K) Printed in Japan
(c)
1998
PG175TA
ABSOLUTE MAXIMUM RATINGS (TA = 25C)
PARAMETERS Supply Voltage AGC Control Voltage Input Power Total Power Dissipation Operating Temperature Storage Temperature SYMBOL VDD1, VDD2 VAGC Pin Ptot TA Tstg RATINGS 6.0 6.0 -8 200Note -30 to +90 -35 to +150 UNIT V V dBm mW C C
Note Mounted on a 50 x 50 x 1.6 mm double copper clad epoxy glass PWB, TA = +85C
PIN CONNECTION AND INTERNAL BLOCK DIAGRAM
PIN NO. 1 2 3 CONNECTION VDD1 GND VDD2 & OUT PIN NO. 4 5 6 CONNECTION VAGC GND IN
Top View
Bottom View
Top View
2 1
G1E
3
4 5 6
4 5 6
3 2 1
3 2 1
4 5 6
RECOMMENDED OPERATING CONDITIONS (TA = 25C)
PARAMETERS Supply Voltage AGC Control Voltage Input Power SYMBOL VDD1, VDD2 VAGC Pin MIN. +2.7 0.5 -21 TYP. +3.0 MAX. +3.3 2.5 -17 UNIT V V dBm
2
Preliminary Data Sheet
PG175TA
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25C, VDD1 = VDD2 = +3.0 V, /4DQPSK modulated signal input, External input and output matching)
PARAMETERS Operating Frequency Total Current AGC Control Current Power Gain Variable Gain Range Adjacent Channel Power Leakage 1 Adjacent Channel Power Leakage 2 Input Return Loss Output Return Loss SYMBOL f IDD IAGC Gp G Padj1 Pin = -21 dBm, VAGC = 2.5 V VAGC = 0.5 to 2.5 V Pin = -21 dBm, VAGC = 2.5 V Pin = -21 dBm, VAGC = 0.5 to 2.5 V Pout = +9 dBm, VAGC = 2.5 V f = 50 kHz, 21 kHz Band Width Pout = +9 dBm, VAGC = 2.5 V f = 100 kHz, 21 kHz Band Width External matching External matching 27 30 TEST CONDITIONS MIN. 925 20 200 30 35 -60 -55 TYP. MAX. 960 30 500 UNIT MHz mA
A
dB dB dBc
Padj2
-70
-65
dBc
RLin RLout
10 10
dB dB
Preliminary Data Sheet
3
PG175TA
EVALUATION CIRCUIT (Preliminary) VDD1 = VDD2 = +3.0 V, f = 950 MHz
VDD1 VDD2 C2 C3 L4 L5 OUT L3 1 2 3 C1
G1E
6 L1 IN L2 VAGC 5 4
Using the NEC Evaluation board
C1 C2, C3 L1 L2 L3 L4 L5 2.0 pF 1000 pF 22 nH 27 nH 12 nH 47 nH 10 nH
4
Preliminary Data Sheet
PG175TA
EVALUATION BOARD (Epoxy Glass, = 4.6, 0.4 mm thickness)
VDD1
OUT L3 C3 L5 38 mm L2 L1 L4 C1 C2 VDD2
IN
VAGC 40 mm
6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)
0.3-0.0
+0.1
0.13 0.1
1
2.8 -0.3
+0.2
2
3
1.5 -0.1
+0.2
0 to 0.1 6 5 0.95 4 0.95 0.8 1.1
+0.2 -0.1
1.9 2.9 0.2
Preliminary Data Sheet
5
PG175TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
Recommended condition symbol IR35-00-3
Soldering process Infrared ray reflow
Soldering conditions Package peak temperature: 235C Hour: within 30 s. (more than 210C) Note Time: 3 times, Limited days: no. Package peak temperature: 215C Hour: within 40 s. (more than 200C) Note Time: 3 times, Limited days: no. Soldering tub temperature: less than 260C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less than 300C, Hour: within 3 s. Note Limited days: no.
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Pin part heating
Note It is the storage days after opening a dry pack, the storage conditions are 25C, less than 65%, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
6
Preliminary Data Sheet
PG175TA
[MEMO]
Preliminary Data Sheet
7
PG175TA
Caution
The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

▲Up To Search▲

Price & Availability of UPG175TA

	To Download UPG175TA Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .